Integration of High Performance Electronics into Flexible Packaging
William Burdick
Principal Engineer
GE Global Research Center
Overview
Speakers
Program
Alejandro L. Briseno
Alex K.-Y. Jen
Antonio Facchetti
Benjamin Schlatka
Carolyn R. Ellinger
David R. Allee
James Watkins
Kenneth R. Carter
L. Jay Guo
Michael D. McCreary
Slade Culp
William Burdick
Venue
Contact
Registration